广合科技PCB背钻板厚量测机采购项目（第二次）发布评标结果公示

广合科技PCB背钻板厚量测机采购项目（第二次）发布评标结果公示项目名称：广合科技PCB背钻板厚量测机采购项目（第二次）项目编号：X-X招标范围：PCB背钻板厚量测机采购。招标X招标XX公司开标时间：X-9-X:X公示开始时间：X-9-X评标公示截止时间：X-9-X:X候选人名单：候选人排名投标商名称制造商制造商国X1珠海博明XX中国珠海2X波若波罗科技X中国深圳DeltonTechnologyPCBBackdrillingBoardThicknessMeasuringMachineProcurementProjectRE-bid-EvaluationResultsProjectName：ProcurementProjectofPCBBackdrillingBoardThicknessMeasuringMachineforDeltonTechnologyCo.,LtdRe-bidBiddingNo.：X-XBiddingContent：ProcurementofPCBBackdrillingBoardThicknessMeasuringMachine.BiddingAgency：GuangdongMachineryElectricalEquipmentTenderingCO.,LTDPurchasers：DeltonTechnologyCo.,Ltd.Open-TimeofBids：X-9-X:XPublicitystarttime：X-9-XEndingDateofEvaluationResult：X-9-X:XWhoproposedthesuccessfulbidder：rankProposedBid-winnerManufacturerManufacturerCountry1ZhuhaiBomingVisionTechnologyCo.,Ltd.ZhuhaiBomingVisionTechnologyCo.,Ltd.ChinaZhuhai2ShenzhenPRAJNAPARAMITATechnologyCo.,Ltd.ShenzhenPRAJNAPARAMITATechnologyCo.,Ltd.ChinaShenzhenX